The promotion of RFID in the global livestock industry varies from country to country. In Canada, the use of low-frequency RFID has been mandated by law for many years. In the United States, cattle associations and cooperatives are addressing identification traceability challenges, and many organizations are now using UHF tags. In Europe, some countries have made the use of UHF mandatory. In the livestock industry, low-frequency RFID (LF RFID) and ultra-high frequency RFID (UHF RFID) each play different roles:

The magnetic field of low-frequency RFID can produce a relatively uniform sensing area, making it difficult to miss or cross-read during one-to-one identification. On the other hand, low-frequency RFID has strong anti-interference ability, strong penetration, and good anti-metal performance. Better than high frequency and ultra high frequency RFID. In large-scale breeding farms, low-frequency RFID reading and writing devices are mostly deployed in application scenarios such as passages, holding racks, milking tables, and feeders for one-to-one identification to meet on-site use.

UHF RFID also has its unique uses in the livestock industry. High-frequency and ultra-high-frequency RFID can perform group reading of tags, which is very useful in scenarios where large amounts of information need to be processed quickly. However, in the field of livestock breeding, omissions and cross-readings sometimes occur. Moreover, the high price and difficulty of installation of UHF technology previously discouraged many cattle raising companies.

Canadian livestock monitoring company HerdWhistle is breaking out of this dilemma, offering an effective and low-cost UHF solution through expanded global distribution partnerships. The solution is designed to provide transparency into the beef supply chain and uses products including UHF RFID readers and antennas, as well as multispectral cameras that track details related to animal health.

HerdWhistle’s UHF RFID Solutions

HerdWhistle provides a solution to this problem by designing specialized RFID antennas that can maintain operation and capture tag data in severe weather, high moisture and dust levels, and unpredictable environmental conditions. In addition, HerdWhistle has developed several handheld readers that can read tags from up to 100 feet away and processing scanners that uses a combination of low and ultra-high frequencies for guiding animals, etc. This solution system also includes a corresponding dedicated multispectral camera that can perform 3D measurements of animals that come within range of the reader. The infrared camera in the camera can display pixelated images in real time to identify animals at risk of disease. By tracking the health of animals, operators can be more strategic in how they vaccinate or use antibiotics. This complete set of application systems provides an effective and low-cost solution that can help feedlots better manage animals, improve production efficiency and reduce operating costs. 

Hopeland Smart Series New UHF RFID Integrated Reader HZ140

Our new smart series RFID Integrated Reader HZ140 and RFID antenna has been successfully used in a similar livestock automatic feeding and management detection system in Brazil, playing an important and key role in the entire system integration project.

Although the promotion situation varies in different regions, with the continuous development and popularization of technology, the UHF RFID system is expected to become one of the mainstream technologies in the animal husbandry industry.

（Some pictures and texts come from the Internet, if there is any infringement, please contact to delete）

With the continuous development of the global retail industry, the problem of improper store theft prevention in some regions has become increasingly prominent. Traditional anti-theft methods, such as electronic anti-theft systems (EAS), can no longer fully meet the needs of modern retailers. In this case, Shrink Analyzer data engine emerged to provide retailers with a brand new solution. Shrink Analyzer is designed for loss detection and analysis through UHF RFID solutions integrated with video processing technology. The system combines RFID data with corresponding video technology to provide retailers with real-time loss insights, helping them take preventive measures and reduce the risk of merchandise loss.

Shrink Analyzer has a wide range of applications. Store managers can adjust security strategies and improve in-store safety based on the analysis results provided by the system. Additionally, the system can indicate which items are vulnerable to theft, or under what conditions and circumstances. Retailers can use this information to take steps to improve the safety of specific products. Another great feature of Shrink Analyzer is the provision of real-time video evidence. When a lost item occurs, the system can go back and find relevant video evidence.

With the continuous advancement of RFID technology, the performance of RFID readers is becoming more and more powerful, but the problem that comes with it is that the problem of stray reading is becoming more and more serious. To solve this problem, this system uses a series of algorithms to filter out radio frequency noise and only capture tag readings when the items leave the store, and correlates the tag readings with the video, greatly improving the accuracy and reliability of the data.

（Some pictures and texts come from the Internet, if there is any infringement, please contact to delete）

Aluminum nitride ceramic substrate, often referred to as polished aluminum nitride ceramic sheet or high thermal conductivity AlN ceramic substrate, is a versatile material with a wide range of applications across various industries. Its unique properties make it an ideal choice for numerous electronic, thermal management, and optoelectronic applications. In this blog post, we will explore the uses and benefits of aluminum nitride ceramic substrates in different fields.

Electronics Industry:

Aluminum nitride ceramic substrates find extensive use in the electronics industry due to their excellent thermal conductivity, electrical insulation properties, and compatibility with semiconductor materials. They are commonly used as substrates for high-power electronic devices such as power amplifiers, integrated circuits, and light-emitting diodes (LEDs). The high thermal conductivity AlN ceramic substrate helps in efficient heat dissipation, thereby enhancing the performance and reliability of electronic components.

Thermal Management:

In thermal management applications, aluminum nitride ceramic substrates play a crucial role in dissipating heat generated by electronic devices. Their superior thermal conductivity enables efficient heat transfer away from sensitive components, preventing overheating and prolonging the lifespan of electronic systems. These substrates are used in heat sinks, heat spreaders, and thermal interface materials for applications where thermal management is critical, such as in automotive electronics, aerospace systems, and power electronics.

Optoelectronics:

Aluminum nitride ceramic substrates are widely employed in optoelectronic devices such as laser diodes, photodetectors, and optical sensors. Their high thermal conductivity, combined with excellent optical transparency in the ultraviolet to infrared spectrum, makes them suitable for optoelectronic applications requiring precise control of thermal and optical properties. Additionally, aluminum nitride substrates offer good mechanical stability and compatibility with semiconductor fabrication processes, making them ideal for integration into various optoelectronic systems.

Microelectronics and MEMS (Microelectromechanical Systems):

Aluminum nitride ceramic substrates are used as platforms for the fabrication of microelectronic devices and MEMS components. Their high dielectric strength, thermal stability, and chemical inertness make them suitable for creating robust and reliable microsystems. Aluminum nitride substrates provide a stable and flat surface for the deposition of thin films and microstructures, enabling the integration of complex electronic and mechanical functionalities in compact devices such as accelerometers, gyroscopes, and microfluidic systems.

In conclusion, aluminum nitride ceramic substrates offer a wide range of benefits and applications across diverse industries, including electronics, thermal management, optoelectronics, and microelectronics. Their unique combination of high thermal conductivity, electrical insulation, optical transparency, and mechanical stability makes them indispensable for various advanced technological applications. As research and development efforts continue to improve the performance and manufacturability of aluminum nitride substrates, we can expect to see further innovations and applications in the future.

The major difference between soft starter and VFD are as follows.

1. Soft starter is used to start and stop the motor smoothly., without jerk load.

2. The starting torque delivering capacity of the soft starter is poor as V/f ratio or the flux is much lower than the rated capacity of the motor flux. It is suitable for the driven equipment which start at almost no load.

3. VFD is also soft start and soft stop the motor. However, VFD delivers constant torque equal to the rated torque of the motor. This is achieved by maintaining v/f ratio constant. In addition, VFD drive factory manufacturers it, mainly used for the applications for which speed control is required. Fan and water supply inverter applications, and it saves the energy.

A soft starter is just that. It allows the motor to ramp up to full speed and maybe ramp down to a stop. An Variable frequency drive is needed to control speed and usually includes additional features such as multiple speed settings and S curve deceleration. Consider the needs of your application and the benefits of additional flexibility versus the difference in cost. For smaller motors, an AC drive will often provide a lot of additional flexibility and future proofing for a small additional cost. But, this is not always the case so it really depends on the details of you application and budget.

A soft starter is a starter configured such that it will ramp up the voltage/current allowing the motor to start off slowly and pick up speed without the typical inrush.

The AC drive is as variable frequency drive which allows the motor to be operated over a range of speed in a controlled manner, and since you can control the speed of the motor it could have the effect of a soft starter.

AC drive is obviously more costly, it can have two acceleration sessions with different ramping rates (from still to minimum speed with and from min speed to target speed), some delay is added prior to start.

Soft Starter is like a 2 stage starter like half voltage when a pump starts rolling a timer runs down then full voltage full speed, AC drive as is description variable voltage has capacitors to vary the voltages.

If an application and say pump at full volume is required then you can go with a Soft Starter (also reduces line voltage inrush current demand when starting), If application requires you to control and able to adjust for a volume demand then go with an AC drive.

"But" you can operate an AC drive at a fixed speed and have the ability control the startup ramp rate and also ramp rate as it shuts down, I haven't had any soft starters ramp a motor down in reverse order as startup just cuts off the voltage when shutting down.

A stepper motor is an electromechanical device that converts electrical pulses into precise mechanical motion. It is designed to move in discrete steps, hence the name "stepper" motor. Unlike conventional motors that rotate continuously, stepper motors rotate incrementally, typically in steps of 1.8 degrees (for a motor with 200 steps per revolution).

The basic construction of a stepper motor consists of multiple toothed electromagnets arranged around a central rotor. The rotor is typically made up of a permanent magnet or a soft magnetic material. The number of teeth on the rotor is usually a multiple of the number of electromagnets surrounding it.

Stepper motors require a specialized driver circuit to control their motion. This driver circuit delivers precise sequences of electrical pulses to the motor windings, which in turn produce the rotational movement.

The most common types of stepper motors are bipolar and unipolar motors:

1. Bipolar Stepper Motor: A bipolar stepper motor has two windings or phases, and each phase can be controlled independently. The windings have a center tap, and the motor can have either four or eight leads. Bipolar motors provide more torque compared to unipolar motors but require more complex driver circuits.

2. Unipolar Stepper Motor: A unipolar stepper motor has multiple windings with a center tap for each phase. The windings are typically energized in a specific sequence to create the steps. Unipolar motors are easier to control but generally provide less torque than bipolar motors.

To rotate the stepper motor, the driver circuit applies voltage or current to the motor windings in a specific sequence. The most common sequence is known as "wave drive" or "one-phase on." In this mode, the driver energizes one phase at a time and steps through the phases in a cyclic manner to rotate the motor.

More advanced driving techniques, such as "full step," "half-step," or "microstepping," can be used to achieve smoother motion or finer positioning. These techniques involve different energization patterns for the motor windings, which divide a full step into smaller increments.

Keli motor as one of the largest micro motor R&D, manufacturers, and exporters in China,we  mainly supply shaded pole motor, stepper motor, DC brushless motor,etc.

1) Super capacitors have a fixed polarity. Before use, confirm the polarity.

2) Super capacitors should be used at nominal voltage. When the capacitor voltage exceeds the nominal voltage, it will cause the electrolyte to decompose, at the same time the capacitor will heat up, the capacity will decrease, and the internal resistance will increase, and the life will be shortened.

3) Super capacitors should not be used in high-frequency charging and discharging circuits. High-frequency fast charging and discharging will cause the capacitor to heat up, the capacity will decrease, and the internal resistance will increase.

4) The ambient temperature has an important effect on the life of the supercapacitor. Therefore, super capacitors should be kept as far away from heat sources as possible.

5) When a supercapacitor is used as a backup power supply, because the supercapacitor has a large internal resistance, there is a voltage drop at the moment of discharge.

6) Super capacitors should not be placed in an environment with relative humidity greater than 85% or containing toxic gases. Under these circumstances, the leads and the capacitor case will be corroded, causing disconnection.

7) Super capacitors should not be placed in high temperature and high humidity environments. They should be stored in an environment with a temperature of -30 to 50 ° C and a relative humidity of less than 60% as much as possible. Avoid sudden temperature rises and falls, as this will cause product damage .

8) When a super capacitor is used on a double-sided circuit board, it should be noted that the connection cannot pass through the capacitor's reach. Due to the way the super capacitor is installed, it will cause a short circuit.

9) When the capacitor is soldered on the circuit board, the capacitor case must not be contacted with the circuit board, otherwise the solder will penetrate into the capacitor through hole and affect the performance of the capacitor.

10) After installing a super capacitor, do not forcibly tilt or twist the capacitor. This will cause the capacitor leads to loosen and cause performance degradation.

11) Avoid overheating capacitors during soldering. If the capacitor is overheated during welding, it will reduce the service life of the capacitor.

12) After the capacitor is soldered, the circuit board and the capacitor need to be cleaned, because some impurities may cause the capacitor to short circuit.

13) When supercapacitors are used in series, there is a problem of voltage balance between the cells. A simple series connection will cause one or more individual capacitors to overvoltage, which will damage these capacitors and affect the overall performance. Therefore, when the capacitors are used in series, , Need technical support from the manufacturer.

14) When other application problems occur during the use of supercapacitors, you should consult the manufacturer or refer to the relevant technical data of the supercapacitor's instructions.

1. Ceramic chip capacitor failure caused by external force

(1) Because the ceramic chip capacitor is brittle and has no pin, it is greatly affected by the force. Once it is affected by the external force, the internal electrode is easy to break, resulting in the failure of the ceramic chip capacitor. As shown in Figures below, the capacitor end of ceramic patch is broken or damaged due to any external force. For example, in the process of mechanical assembly, the printed circuit board assembly is installed in the box, and the electric driver is used for assembly. At this time, the mechanical stress of the electric driver is easy to disconnect the capacitor. 

(2) Due to the quality problem of poor bonding force of ceramic chip capacitor end (body and electrode), the metal electrode is easy to fall off through the process of welding, warm punching, debugging and other external forces, that is, the body and electrode are separated, as shown in Figure as below.

 2. Failure caused by improper welding operation

(1) It is very common that the thermal shock of ceramic chip capacitor caused by improper manual welding or rework of electric iron.

When welding, there will be thermal shock. If the operator contacts the tip of the soldering iron directly with the electrode of the capacitor, the thermal shock will cause the micro crack of the ceramic chip capacitor body, and the ceramic chip capacitor will fail after a period of time. In principle, the SMT should be welded by hand. Multiple welding, including rework, will also affect the solderability of the chip and the resistance to welding heat, and the effect is cumulative, so it is not suitable for the capacitor to be exposed to high temperature for many times

(2) The tin on both ends of the capacitor is asymmetric during welding.

When welding, the tin on both ends of the capacitor is asymmetric, as shown in below figure.

The tin on both ends of the capacitor is asymmetric. When the capacitor is subjected to external force or stress screening test, the ceramic patch will be seriously affected due to excessive soldering. The capacitor's ability to resist mechanical stress will lead to cracking of the body and electrode and failure.

(3) Too much solder

The factors related to the degree of mechanical stress of multilayer ceramic chip capacitor on PCB include the material and thickness of PCB, the amount of solder and the position of solder. Especially, too much solder will seriously affect the ability of chip capacitor to resist mechanical stress, resulting in capacitor failure.

3. Capacitor failure caused by unreasonable pad design

(1) The design of the pad is unreasonable, as shown in below Figure, when there is a hole in the pad. Solder will lose (there is such design phenomenon in the product), which causes welding defects due to the asymmetry of solder at both ends of capacitor. At this time, stress screening or external force will be conducted. The stress released at both ends of ceramic chip capacitor will easily cause cracking and failure.

(2) Another pad design is shown in below Figure. When using on-line welding, the size of pads at both ends of the capacitor is different or asymmetric (this design phenomenon exists in the product), the amount of solder paste printed is quite different. The small pad has a fast response to temperature, and the solder paste on it melts first. Under the action of solder paste tension, the component is straightened up, resulting in "upright" phenomenon or solder asymmetry, causing capacitor failure. One end of several ceramic chip capacitors share a large pad. If one capacitor at the common end needs to be repaired or one of the capacitors fails and needs to be replaced, one end of the other components will also experience a thermal shock, and the capacitor is prone to failure.

4. Failure caused by high and low temperature impact test

During the test, the thermal expansion coefficient (CTE) of PCB, MLCC end electrode and ceramic dielectric is small, and the chip capacitor is subjected to certain thermal stress due to the rapid change of cold and hot. The body (ceramic) and electrode (metal) of SMC produce stress cracks, which lead to the failure of SMC.

5. Failure caused by mechanical stress

Improper operation of the printing plate in the assembly process will cause mechanical stress, which will lead to capacitor rupture, and the pad is designed near the screw hole, which is easy to cause mechanical damage during assembly. This kind of damage makes the crack expand further in the temperature shock test, which leads to the capacitor failure. It can be seen from the structure that MLCC can withstand large compressive stress, but its bending resistance is poor. Any operation that may produce bending deformation during capacitor assembly will lead to component cracking.

Hermetically Sealed High Energy Tantalum Capacitor is high-performance, high-energy density, low impedance and full sealing. With the innovative multi-anode parallel structure, the self-impedance of the capacitor is significantly reduced, resulting in lower heat generation and higher reliability during high-power-density charging and discharging. Additionally, it can be used in circuits with some AC components for discharging and dual-purpose filtering as a filter and power compensation device.

To ensure high reliability during usage, please take note of the following points.

1. Test

1.1 Hermetically Sealed High Energy Tantalum Capacitor is a polar component, the polarity must not be reversed during use and testing. If the polarity is reversed, the reliability of the capacitor will be irreversibly damaged and cannot be used anymore.

1.2 Capacitance & Dissipation Factor Measuring Conditions: 1.0Vrms@100Hz

1.3 Equivalent Series Resistance（ESR）：measuredat1000Hz,1Vrms

1.4 Leakage current test: Apply rated voltage or class voltage for 5min. The qualified standards for leakage current can be found in the product specifications and corresponding specifications.

1.5 Professional testing instruments and fixtures must be used. A multimeter cannot be used to test any parameters of hermetically sealed high energy tantalum capacitor. It is not possible to use a multimeter to test it regardless of polarity.

1.6 Hermetically sealed high energy tantalum capacitor can store a high amount of electrical energy, after conducting a leakage current test, the capacitor must be thoroughly discharged by a standard leakage current tester before use.

Discharge resistance: 1000 ohms;

Discharge time: ≥ 5mins

Residual voltage after discharge：＜1V

1.7 Test of electrical performance must be carried out in the following order and cannot violate.

Test sequence: Capacitance & Dissipation Factor - ESR - Leakage Current – Discharge

2. Precautions for use on different circuits

2.1 Delay protection circuit

The capacitors used in such circuits primarily serve as backup power for unexpected power outages, requiring them to automatically engage when the main power source suddenly fails. They must maintain a specified power supply duration under certain voltage and power density requirements. When designing circuits of this nature, please pay attention to the mathematical relationship between the total impedance of the capacitor's downstream circuit and the required voltage, capacitor capacity, and power needs. Additionally, during the design phase, it is advisable to leave at least a 50% margin in capacitor capacity selection to ensure that there is enough power supply time and power density in case of unforeseen factors. The specific calculation is as follows:

When the circuit is working normally,

Input power: P

Capacitance: C

Voltage at both ends: U1

Then, the energy stored by the capacitor is

 W1=C（U12）/2

Where U12 represents the square of U1.

When the input power supply drops out, after a time t, the voltage at both ends U2,

Then, the remaining energy of the capacitor is

W2=C（U22）/2

The energy released during this process:

W=W1-W2=C（U12-U22）/2

It should be equal to the energy required to keep the circuit working properly:

W=Pt（i.e. input power multiplied by time）

Therefore,

C（U12-U22）/2=Pt

From this, the minimum capacitance required for the circuit maintenance time t can be obtained as:

C=2Pt/（U12-U22）

In practical applications, U2 is the minimum input voltage that a circuit can operate normally.

Example:

If when the circuit is working normally, the input voltage is 28V (U1), the input power is 30W (P), and the minimum input voltage that can work normally is 18V (U2). It is required that the circuit can still work even after a 50 millisecond (t) power drop-out from the input power supply, then the minimum capacitance required for energy storage capacitance is

C=2Pt/（U12-U22）

 =2×30×50/（282-182）

 =3000/（784-324）

 =6.522mF=6522μF

An energy storage capacitor used in the front end of a power supply circuit has an input voltage of 50 V. When the power is cut off, the capacitor begins to supply energy to the subsequent circuit, and the voltage must be maintained at not less than 18 V while supplying energy for 75 W. Calculate the required capacitance.

This circuit also requires an accurate loop resistance. The size of the circuit resistance determines the required capacity of the capacitor.

The conversion formula for the performance of each parameter in this circuit is as follows:

C=R×PT×T/(U1-U2)

In the equation:

C: Required capacitance (F)

R: Total circuit resistance (Ω)

Pt: The power that the circuit needs to maintain (W)

T: Loop power holding time (s)

U1: Input voltage (V)

U2: Voltage that can maintain a certain power and discharge time (V)

The capacitor used in such circuits must be derated to within 70% of the rated voltage.

2.2 Charging and discharging circuit

Due to its high energy density and low impedance characteristics, this capacitor is the best choice for high-power discharge circuits. The hermetically sealed high energy tantalum capacitor used in such circuits can still achieve high power density infinite charging and discharging under certain conditions and still has high reliability. It is the best instantaneous power supply.

In such circuits, the relationship among the capacitance of capacitors, the output power density and load power can be calculated by referring to clause 2.1.

In this type of circuit, the maximum discharge current I to which the capacitor can be subjected individually must not exceed 50% of the current value calculated in the following formula;

Due to the inherent thermal equilibrium issue that capacitors inevitably face during high-power discharges, the maximum DC current pulse that tantalum capacitors can safely withstand in a DC high-power discharge circuit with a fixed impedance is determined by the following formula:

I=UR /（R+ESR）

In the equation:

I: Maximum DC surge current (A)

R: The total impedance of the circuit for testing or discharging (Ω)

UR: Rated voltage (V)

ESR: Equivalent series resistance (Ω)

From the above formula, it can be observed that if a product has a higher ESR (Equivalent Series Resistance), its safe DC surge current capability will be reduced. This also implies that if one product has half the ESR of another, its resistance to DC surge will be twice as high, and its filtering characteristics will be better as well.

When using capacitors in such circuits, since the capacitors operate continuously at high power levels, the actual operating voltage should not exceed 70% of the rated voltage. Considering the impact of heat dissipation on reliability, it is even better to derate the usage to below 50% for higher reliability.

Furthermore, when using this type of capacitor in such circuits, due to the high operating current, the capacitor will experience some heating. When designing the capacitor's placement, it is essential to ensure that it is not positioned too close to other heat-sensitive components. Additionally, the installation space for this capacitor must have good ventilation.

2.3 Filtering and power compensation for the power supply secondary 

The allowable AC ripple value of the capacitor used in such circuits must be strictly controlled. Otherwise, excessive AC ripple can lead to significant heating of the capacitor and reduced reliability. In principle, the maximum allowable AC ripple value should not exceed 1% of the rated voltage, the current should not exceed 5% of the maximum permissible discharge current, and the maximum allowable operating voltage of the capacitor should not exceed 50% of the rated voltage.

3. Derating design of hermetically sealed high energy tantalum capacitor

In general, the reliability of capacitors is closely related to the operating conditions of the circuit. To ensure an adequate level of reliability during usage, it is essential to adhere to the following principles:

3.1 Reduce more rather than less

Because the greater the derating of capacitors, the higher the reliability in handling unexpected power shocks. Additionally, derating design should be based on reliability under possible extreme usage conditions, such as high operating temperatures, high ripple currents, and significant temperature and power fluctuations.

3.2 Select large capacity rather than small

The larger the capacitance, the higher the instantaneous electrical energy it can provide. Additionally, since this capacitor falls under the basic category of tantalum electrolytic capacitors, it experiences greater capacity loss at low temperatures (compared to solid tantalum capacitors). Therefore, the capacity selection should be based on the capacity at extreme negative temperatures. This is particularly important for capacitors used at high altitudes. Specific capacity variations at low temperatures can be found in the product specifications and relevant standards.

3.3 Selection of Impedance

For circuits used in situation 2.3, it is essential to choose products with a lower ESR whenever possible for higher reliability and improved filtering performance.

3.4 Selection of Capacitor Size

Due to the fact that smaller products with the same capacity and voltage must be manufactured using tantalum powder with higher specific capacity, the ESR of the product will be higher, and the leakage current will also be greater. Therefore, the reliability of the product will be lower than that of larger products. When installation space allows, products with larger volumes should be used as much as possible to achieve higher reliability.

4. Installation

4.1 Installation ways 

The positive lead wire of hybrid energy tantalum capacitors cannot be directly welded to the circuit board, but must be welded to the circuit board through the external lead wire. High energy tantalum composite will be present.

There are three ways to install the circuit board, as shown below:

Figure 1：Installation mode of single negative pole lead (fixed by mounting frame)

 Figure 2：Double negative or triple negative lead installation mode (fixed by negative lead)

Figure 3：Double screw or triple screw installation (fixed by screw)

4.2 Considerations for Installation Method Selection 

Due to the relatively large mass and size of this capacitor, it is advisable to adhere to the following principles during installation:

（a）For specifications with large size and mass, standard mounting brackets provided by the manufacturer should be used as much as possible to ensure that the connection between the product and circuit will not experience instantaneous open circuits when the equipment encounters large vibrations and overload impacts, and also to ensure installation strength requirements.

(b) For conditions where size and mass are relatively small and there are stringent requirements for installation space, capacitor products with built-in mounting bolts can be used. For such installations, it is essential to ensure that the circuit board has a high level of strength. Additionally, after tightening the mounting bolts, epoxy-based sealant must be used to secure the bolts. If conditions allow, other forms of fastening (such as applying adhesive to the capacitor base) can also be employed to ensure that the capacitor's mounting strength meets the requirements for extreme conditions of use.

(c) For products used in high-power continuous discharge circuits, capacitors should not be installed too close to devices with significant heat dissipation to prevent the capacitor from overheating and experiencing reduced reliability. Additionally, capacitors used in such circuits should not have heat-insulating sealant coatings applied to their casings to avoid a decrease in heat dissipation performance, which could lead to increased temperatures and reduced reliability of the capacitors.

(d) For products used in high-power uninterrupted discharge circuits, it is essential to have good ventilation conditions to ensure that the heat generated by the capacitors can be promptly expelled, preventing excessive temperature rise of the capacitors.

(e) The anode lead of hermetically sealed high energy tantalum capacitor is connected to the casing with an insulating ceramic material. Therefore, during installation, the positive lead that is fixed to the circuit board must be connected using nickel-based leads that are soldered on; it is not permissible to directly solder the excessively short tantalum leads onto the circuit board. This is because short positive leads can compromise the capacitor's seal when subjected to high overload and high-frequency vibrations, leading to leakage and capacitor failure.

5. Circuit protection

5.1 If the selected capacitor operates at a frequency with significant power variations, it is advisable to implement overload protection in the power supply circuit providing energy compensation to the capacitor. This helps prevent overloading of the power supply when there is a sudden surge in starting current.

5.2 The circuit in which this capacitor is used must have reverse voltage control and a separate discharge path to prevent the capacitor from experiencing reverse surges during operation and shutdown. The energy stored in the capacitor should be correctly discharged after use.

Digital signage LED walls refer to large-scale displays made of multiple LED panels or modules arranged in a grid-like configuration to create a seamless and immersive visual display. These LED walls are used for advertising, information dissemination, and entertainment purposes in various indoor and outdoor locations.

LED walls offer several advantages over traditional signage methods:

1. Brightness and Visibility: LED walls are highly luminous, ensuring excellent visibility even in brightly lit environments. They can produce vibrant and eye-catching visuals that attract attention.

2. Scalability: LED walls are modular, allowing for easy expansion or reduction in size as per the specific requirements of the display space. Additional LED panels can be seamlessly integrated to increase the wall's size or resolution.

3. Seamless Integration: LED panels are designed to fit together seamlessly, creating a uniform display surface without visible gaps. This ensures that the content appears cohesive and continuous across the entire wall.

4. Flexibility in Content Display: LED walls can display a wide range of content types, including static images, videos, animations, text, and interactive elements. They provide flexibility in content management and can easily be updated and scheduled remotely.

5. Durability and Longevity: LED walls are built using robust materials, making them resistant to environmental factors such as dust, moisture, and temperature variations. They have a longer lifespan compared to other display technologies.

6. Energy Efficiency: LED technology is energy-efficient, consuming less power than traditional display methods. This can result in cost savings in the long run and lower environmental impact.

7. Dynamic and Engaging Experience: LED walls offer a dynamic and immersive visual experience. Their large size and high resolution allow for impactful storytelling and engaging interactions with the audience.

Overall, digital signage LED walls provide a versatile and visually captivating solution for advertising, information sharing, and creating immersive environments in various settings such as retail stores, stadiums, airports, hotels, and corporate buildings.

Jezetekledscreen as a professional led display manufacturer and supplier in China,we mainly supply Indoor Small Pitch LED Display,XR Virtual Display,Creative LED display,All-in-one Display,etc. 20 years led industry experiences,ODM/OEM are avalible!

This study was conducted to establish a new type of the archive management system of ancient and famous trees so as to solve the problems of errors and low efficiency in traditional archive management, while with more and more types and quantities of archive materials. RFID was used to realize the management of file storage, inspection, inventory and failure, for this technology could effectively reduce the manual operation, improve the operation efficiency and realize the automatic and intelligent management of files.

Besides, combined with various sensors, this technology could realize the dynamic real-time monitoring of the archives warehouse, and provide a good storage environment for the ancient and famous tree archives. The intelligent archives management system of ancient and famous trees in Ji’nan based on RFID technology was established by using RFID and Internet of Things technology, combined with information materials, such as the ancient and famous tree resource investigation, identification and protection, maintenance and rejuvenation, daily management, migration approval and so on.

Old and valuable trees are priceless treasures left to mankind by nature and predecessors, with important resource value, humanistic value, historical value, cultural relics value, ornamental value, ecological value and greening scientific research value Combining RFID technology and digital archives construction with scientific management of archives entities to realize a scientific, efficient and highly modernized management of archives construction of the new model has become possible. As an emerging identification technology, RFID technology is widely used in material

As an emerging identification technology, RFID technology is widely used in the fields of material tracking, production automation control, warehousing management, railroad vehicles and freight container identification, etc. [5]. With the increasing maturity of RFID technology, RFID application in archive management, has its reference and feasibility.

RFID-based ancient and valuable trees intelligent archive warehouse management system architecture is mainly divided into data collection, data transmission, data storage and business applications at four levels

Data collection layer is mainly the use of RFID technology, combined with desktop card issuer, file intelligent cabinet, printer, temperature and humidity sensors, water leakage sensors, after the external sensors and other equipment, real-time reading of old and valuable trees file tag information, realizing real-time supervision of the file; data transmission layer is the use of the system's internal network data transmission; data storage layer is the use of the project's servers and the government cloud storage of the mutual backup, to ensure that the archives Data storage layer is the server used in the project and the government cloud storage mutual backup, to ensure the security of the archive data; business application layer is through the cloud computing technology and software development technology, to realize the business application requirements of multi-user.

The RFID-based intelligent archive management system for old and valuable trees mainly consists of four modules: intelligent cabinet management, archive management, security management and dynamic environment monitoring.

Intelligent archive management can provide more convenient archive access experience. Through RFID tags, you can quickly find the required files and realize instant access through the intelligent storage system.

Making full use of RFID technology, it effectively reduces manual operation, improves operation efficiency, and realizes automation and intelligent management of archives; combining with various sensors, it realizes real-time monitoring of the dynamic environment of the archive storage room, and provides a good storage environment for the archives of old and valuable trees.