What is F4BM300 PCB and its applications?
What is F4BM300 PCB and its applications?
Introduction
Wangling is proud to introduce the F4BM300 PCB, a cutting-edge laminated board that combines fiberglass cloth, polytetrafluoroethylene (PTFE) resin, and PTFE film. Building upon the success of the F4B300, the F4BM300 offers improved electrical performance, lower dielectric loss, increased insulation resistance, and enhanced stability. With its exceptional characteristics, this F4B High Frequency PCB is a reliable and efficient alternative to similar foreign products in the market.
Dielectric Layer and Copper Foil Combinations
The F4BM300 and the F4BME300 share the same dielectric layer, which allows for precise control of the dielectric constant, resulting in reduced loss and enhanced dimensional stability. However, these two laminates differ in their copper foil combinations. The F4BM300 is paired with ED copper foil, making it suitable for applications without the need for PIM (Passive Intermodulation) requirements. On the other hand, the F4BME300 utilizes reverse-treated foil (RTF) copper foil, providing excellent PIM performance, more precise line control, and lower conductor loss.
Features of F4BM300
The F4BM300 F4B PCB Material boasts remarkable features that make it an exceptional choice for high-frequency applications:
2.1 Dielectric constant (Dk) of 3.0 at 10GHz:
This attribute ensures stable signal transmission and reduced signal loss, enabling optimal performance in demanding RF environments.
2.2 Dissipation factor of .0017 at 10GHz:
The low dissipation factor indicates minimal energy loss and improved signal integrity, allowing for accurate and reliable data transmission.
2.3 Coefficient of Thermal Expansion (CTE):
The F4BM300 exhibits a CTE x-axis of 12 ppm/°C, CTE y-axis of 15 ppm/°C, and CTE z-axis of 95 ppm/°C in the temperature range of -55°C to 288°C. This exceptional thermal stability ensures the board's reliability and performance across various operating conditions.
2.4 Low thermal coefficient of Dk:
With a thermal coefficient of Dk at -80 ppm/°C in the temperature range of -55°C to 150°C, the F4BM300 guarantees consistent electrical performance, even under challenging thermal conditions.
2.5 Moisture absorption of≤0.08%:
This low moisture absorption rate ensures the stability and reliability of the PCB, even in humid environments.
2.6 Flammability rating of UL-94 V0:
The F4BM300 complies with the UL-94 V0 standard for flammability, offering peace of mind and safety in applications where fire resistance is a crucial requirement.
PCB Stackup and Construction Details
The F4BM300 60mil F4B Substrate PCB follows a 2-layer rigid construction, with copper layers on both sides of the core material:
Copper_layer_1: 35μm
F4BM300 Core: 1.524 mm
Copper_layer_2: 35μm
To ensure precision and adherence to quality standards, the F4BM300 PTFE F4B PCB incorporates specific construction details:
-Board dimensions:
The board measures 700mm x 40mm, with a tolerance of +/- 0.15mm, ensuring consistency and uniformity.
-Minimum Trace/Space:
The PCB allows for a minimum trace/space of 5/5 mils, facilitating intricate circuit designs and enabling high-density component placement.
-Minimum Hole Size:
The F4BM300 PCB supports a minimum hole size of 0.4mm, accommodating various types ofcomponents and allowing for reliable interconnectivity.
-No Blind vias:
The absence of blind vias simplifies the construction process and ensures optimal signal transmission throughout the board.
-Finished board thickness:
The finished board thickness is 1.6mm, striking a balance between rigidity and flexibility for optimal performance.
-Finished Cu weight:
The outer layers of the F4BM300 PCB have a finished Cu weight of 1oz (1.4 mils), providing excellent conductivity and signal integrity.
-Via plating thickness:
The vias are plated with a thickness of 20μm, ensuring reliable electrical connections and optimal signal transmission.
-Surface finish:
The F4BM300 PCB utilizes immersion tin as the surface finish, offering excellent solderability and a level surface for component placement.
-Silkscreen and Solder Mask:
The top silkscreen is white, allowing for clear component identification and alignment. The green solder mask on both the top and bottom layers provides protection and insulation.
-Electrical Testing:
Each F4BM300 PCB undergoes a 100% electrical test before shipment, ensuring the integrity of the product and adherence to quality standards.
PCB Statistics
The F4BM300 1.524mm high frequency material PCB is designed to accommodate a diverse range of components and applications. Here are some relevant statistics:
Components: The F4BM300 supports the integration of up to 51 components, enabling complex circuitry designs and versatile applications.
Total Pads: With a total of 76 pads, the PCB offers ample connectivity options for reliable circuit interconnections.
Thru Hole Pads: The F4BM300 incorporates 37 thru-hole pads, accommodating components that require a through-hole mounting method.
Top SMT Pads: The top layer of the PCB features 49 surface mount technology (SMT) pads, ensuring efficient and space-saving component placement.
Bottom SMT Pads: The F4BM300 does not have any bottom SMT pads, providing additional flexibility in component placement and routing.
Vias: The PCB includes 32 vias, enabling multi-layer interconnectivity and ensuring efficient signal flow.
Nets: With 2 nets, the F4BM300 lays the foundation for diverse circuit designs and optimized signal routing.
Artwork and Quality Standards
The F4BM300 60mil PCB accepts Gerber RS-274-X artwork files, simplifying the manufacturing process and ensuring compatibility with industry-standard software tools. Moreover, the PCB adheres to the IPC-Class-2 quality standard, guaranteeing excellent quality control and reliable performance.
Availability and Typical Applications
The F4BM300 substrate PCB is available worldwide, allowing engineers and manufacturers to access its exceptional features and benefits. This versatile laminate finds applications in various fields, including:
1)Microwave, RF, and radar systems:
The F4BM300 ensures superior signal integrity and reliable performance in high-frequency systems, enabling seamless communication and accurate data transfer.
2)Phase shifters:
With precise control of the dielectric constant, the F4BM300 facilitates precise phase shifting, essential in applications such as beamforming and phased array systems.
3)Power dividers, couplers, and combiners:
The F4BM300's low dielectric loss and enhanced dimensional stability make it an ideal choice for efficient power distribution and signal combination.
4)Feed networks:
The F4BM300 provides reliable interconnectivity in feed networks, enabling efficient and stable signal transmission in complex antenna systems.
5)Phase-sensitive antennas and phased array antennas:
With its superior electrical performance, the F4BM300 empowers the creation of phase-sensitive antennas and phased array antennas, crucial for beamforming and beam steering applications.
6)Satellite communications:
The F4BM300 supports stable signal transmission in satellite communication systems, guaranteeing reliable data transfer and enhanced connectivity.
7)Base station antennas:
The F4BM300 ensures optimal signal quality and improved performance in base station antennas, enabling efficient wireless communication.
Conclusion
The F4BM300 60mil PCB from Wangling offers exceptional electrical performance, enhanced stability, and improved dielectric characteristics. With its precise control of the dielectric constant, low dielectric loss, and excellent dimensional stability, it serves as a reliable and efficient alternative to foreign products. From microwave and RF systems to satellite communications, this laminated board delivers outstanding results in various high-frequency applications. It is time for engineers and manufacturers around the globe to harness the power of the F4BM300 high frequency PCB and unlock the full potential of their.
